Key Points
- SK Hynix and Intel are discussing options that could bring SK Hynix memory-chip manufacturing to the United States for the first time.
- One proposal involves leasing part of Intel’s Ohio semiconductor complex, while another could involve a joint venture with major cloud companies.
- No agreement has been reached, and the companies have not decided which memory products would be manufactured at the site.
SK Hynix is discussing a potential manufacturing partnership with Intel that could significantly expand the South Korean memory producer’s U.S. footprint. Reuters reported Wednesday that the companies are considering several structures, including SK Hynix leasing capacity at Intel’s delayed Ohio semiconductor complex. Another option could bring cloud-computing companies into a joint venture designed to secure additional memory supply as artificial-intelligence infrastructure drives demand for DRAM and high-bandwidth memory. The negotiations remain preliminary, with no final investment, manufacturing technology or production schedule agreed.

Intel’s Ohio Site Emerges as an Option
One of the possibilities under discussion would allow SK Hynix to use part of Intel’s Ohio manufacturing complex rather than immediately constructing another U.S. wafer fabrication facility from scratch.
A second scenario reportedly involves a joint venture between Intel, SK Hynix and major cloud-service providers. Such companies are among the largest buyers of computing infrastructure supporting artificial-intelligence workloads. The talks could therefore address two different problems.
SK Hynix would gain additional U.S. manufacturing capacity as customers and Washington seek more domestically produced semiconductors. Intel, meanwhile, could attract another major semiconductor company to an Ohio project that has faced delays and substantial capital requirements. Intel has pushed the expected production start at its Ohio facilities to approximately 2030 and 2031 as it adjusts construction spending to market demand.
HBM or DRAM Production Has Not Been Decided
The largest unanswered question is what SK Hynix would actually manufacture in Ohio. The company is one of the world’s largest producers of DRAM and NAND flash and has established a particularly important position in High Bandwidth Memory, or HBM.
HBM is increasingly important to AI accelerators because it provides the extremely high memory bandwidth required to move large amounts of data between memory and processors.
Reuters’ sources said the companies have not decided whether HBM, conventional DRAM or another type of memory would be manufactured at Intel’s Ohio facilities. That distinction matters because transferring advanced semiconductor manufacturing technology outside South Korea could require regulatory scrutiny.
South Korea’s trade ministry told Reuters that the investment decision belongs to SK Hynix, but technology designated as nationally important can be reviewed under the country’s Industrial Technology Protection Act.
SK Hynix Already Has a $4 Billion U.S. Project
A potential Intel agreement would expand an American strategy that is already underway. SK Hynix officially broke ground in August on an advanced AI-memory facility in West Lafayette, Indiana, where it plans to invest more than $4 billion.
SK Hynix’s Indiana project will focus on advanced packaging and testing of next-generation HBM. The company expects the cleanroom to open by October 2028 and mass production to begin during the second half of 2029. However, the Indiana operation does not represent complete U.S. production of HBM from the wafer stage.
SK Hynix says cutting-edge wafers will initially be manufactured in South Korea, shipped to Indiana and then undergo advanced packaging and testing in the United States. An Ohio manufacturing arrangement could therefore represent a deeper step into American semiconductor production if it eventually includes front-end memory-chip fabrication.
AI Demand Raises Pressure to Expand Capacity
The negotiations arrive as demand for AI infrastructure puts pressure on global memory supplies. Modern AI systems require large quantities of HBM alongside GPUs and other accelerators. SK Hynix has consequently expanded investment in manufacturing capacity both inside and outside South Korea.
The company announced in August that it would invest 54 trillion won in new production facilities at Yongin and Cheongju to secure additional long-term capacity for AI memory.
SK Hynix shares responded positively to Wednesday’s report, rising 2.7% to 1.735 million won, compared with roughly a 1% advance in South Korea’s benchmark KOSPI.
Earlier Intel Acquisition Report Was Different
There is also an important clarification surrounding previous reports about the Ohio complex. In July, SK Hynix formally told the U.S. Securities and Exchange Commission that although it continuously evaluates investment opportunities, it had not pursued or made a decision to acquire Intel’s Ohio land and fabrication facilities.
The latest Reuters report does not necessarily contradict that statement. The current negotiations concern potential leasing, manufacturing cooperation or a joint venture, rather than a confirmed purchase of Intel’s Ohio campus. No transaction has been finalized.
Conclusion
Discussions between SK Hynix and Intel could become an important development in the effort to expand advanced memory manufacturing in the United States, but the project remains at an early stage. SK Hynix already has a more than $4 billion HBM packaging investment in Indiana, while Intel has billions of dollars committed to its delayed Ohio manufacturing complex. Combining those strategies could give SK Hynix deeper access to U.S. production while helping Intel make greater use of its Ohio investment.
The critical questions remain unresolved: what chips would be manufactured, who would finance the project, whether cloud companies would participate and whether South Korea would approve transfers involving sensitive memory technology. Until those details are settled, the discussions represent a potentially significant U.S. semiconductor partnership—not a completed SK Hynix-Intel manufacturing deal.
Sources & Methodology
Primary-source standard: Market-moving facts should link to original data releases, regulator notices, company filings or official project announcements whenever available. Secondary reporting is used for additional context, not as a substitute for original evidence.
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